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MCP14628
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1 .
TABLE 3-1:
PIN FUNCTION TABLE .
SOIC
1
2
3
4
5
6
7
8
—
3x3 DFN
1
2
3
4
5
6
7
8
PAD
Symbol
HIGHDR
BOOT
PWM
GND
LOWDR
V CC
FCCM
PHASE
NC
Description
High-side Gate Driver Pin
Floating Bootstrap Supply Pin
PWM Input Control Pin
Ground
Low-side Gate Driver Pin
Supply Input Voltage
Forced Continuous Conduction Mode Pin
Switch Node Pin
Exposed Metal Pad
3.1
High-side Gate Driver Pin
3.6
Supply Input Voltage Pin (V CC )
(HIGHDR)
The HIGHDR pin provides the gate drive signal to
control the high-side power MOSFET. The gate of the
high-side power MOSFET is connected to this pin.
The V CC pin provides bias to the MCP14628. A bypass
capacitor is to be placed between this pin and the GND
pin. This capacitor should be placed as close to the
MCP14628 as possible.
3.2
Floating Bootstrap Supply Pin
3.7
Forced Continuous Conduction
(BOOT)
The BOOT pin is the floating bootstrap supply pin for
the high-side gate drive. A capacitor is connected
between this pin and the PHASE pin to provide the
necessary charge to turn on the high-side power MOS-
FET.
Mode Pin (FCCM)
The FCCM pin enables or disables the forced
continuous conduction mode. With the FCCM pin con-
nected to ground the MCP14628 enters a diode emula-
tion mode to improve system efficiency at light loads.
Continuous conduction is forced if the FCCM pin is
connected to V CC .
3.3 PWM Input Control Pin (PWM)
The control input signal is supplied to the PWM pin.
3.8
Switch Node Pin (PHASE)
This tri-state pin controls the state of the HIGHDR and
LOWDR pins. Placing a voltage equal to V CC /2 on this
pin causes both the HIGHDR and LOWDR to a low
state.
The PHASE pin provides the return path for the high-
side gate driver. The source of the high-side power
MOSFET is connected to this pin.
3.9
DFN Exposed Pad
3.4
Ground Pin (GND)
The exposed metal pad of the DFN package is not
The GND pin provides ground for the MCP14628 cir-
cuitry. It should have a low impedance connection to
the bias supply source return. High peak currents will
flow out the GND pin when the low-side power
MOSFET is being turned off.
internally connected to any potential. Therefore, this
pad can be connected to a ground plane or other
copper plane on a printed circuit board to aid in heat
removal from the package.
3.5
Low-side Gate Driver Pin
(LOWDR)
The LOWDR pin provides the gate drive signal to
control the low-side power MOSFET. The gate of the
low-side power MOSFET is connected to this pin.
DS22083A-page 8
? 2008 Microchip Technology Inc.
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